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Описание товара GIGABYTE H261-Z60 (rev. 100)
HCI Server – AMD DP 2U 4 Nodes Server
- 2U - 4 nodes with rear access to the node trays
- Dual AMD EPYC™ 7001 series processor family
- 8 x LGA 4094 sockets
- 8-Channel RDIMM/LRDIMM DDR4, 64 x DIMMs
- 8 x 1Gb/s LAN ports (Intel® I350-AM2)
- 4 x Dedicated management ports
- 1 xCMC global management port
- 24 x 2.5" hot-swappable HDD/SSD bays
- 8 x M.2 with PCIe Gen3 x4 interface
- 8 x Low profile PCIe Gen3 expansion slots
- 4 x OCP 2.0 Gen3 x16 mezzanine slots
- Aspeed® AST2500 remote management controller
- 2200W 80 PLUS Platinum redundant PSU
- Optimized performance with Mellanox Infiniband EDR 100G or Ethernet 100G products
Технические характеристики
Dimensions (WxHxD, mm)
2U 4 Nodes - Rear access
440 x 87 x 820
440 x 87 x 820
Motherboard
MZ61-HD0
CPU
AMD EPYC™ 7001 series processor family
Dual processors, 14nm
Up to 32-core, 64 threads per processor
TDP up to 200W
NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable
Dual processors, 14nm
Up to 32-core, 64 threads per processor
TDP up to 200W
NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable
Socket
Per Node:
2 x LGA 4094
Total:
8 x LGA 4094
Socket SP3
2 x LGA 4094
Total:
8 x LGA 4094
Socket SP3
Chipset
System on Chip
Memory
Per node:
16 x DIMM slots
Total:
64 x DIMM slots
DDR4 memory supported only
8-Channel memory architecture
RDIMM modules up to 64GB supported
LRDIMM modules up to 128GB supported
Memory speed: 2666/2400/2133 MHz
16 x DIMM slots
Total:
64 x DIMM slots
DDR4 memory supported only
8-Channel memory architecture
RDIMM modules up to 64GB supported
LRDIMM modules up to 128GB supported
Memory speed: 2666/2400/2133 MHz
LAN
Per node:
2 x 1GbE LAN ports (1 x Intel® I350-AM2)
1 x Dedicated management port
Total:
8 x 1GbE LAN ports (1 x Intel® I350-AM2)
4 x Dedicated management ports
1 x 10/100/1000 *CMC global management port
*CMC: Chassis Management Controller, to monitor all status of computing nodes
2 x 1GbE LAN ports (1 x Intel® I350-AM2)
1 x Dedicated management port
Total:
8 x 1GbE LAN ports (1 x Intel® I350-AM2)
4 x Dedicated management ports
1 x 10/100/1000 *CMC global management port
*CMC: Chassis Management Controller, to monitor all status of computing nodes
Video
Integrated in Aspeed® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Management chip on CMC board:
Integrated in Aspeed® AST1250
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Management chip on CMC board:
Integrated in Aspeed® AST1250
Audio
N/A
Storage
Per node:
6 x 2.5" SATA hot-swappable HDD/SSD onboard SATA ports
or
4 x 2.5" SATA /SAS hot-swappable HDD/SSD with SAS RAID Card
Total:
24 x 2.5" hot-swappable HDD/SSD bays
SAS card is required for SAS devices support
6 x 2.5" SATA hot-swappable HDD/SSD onboard SATA ports
or
4 x 2.5" SATA /SAS hot-swappable HDD/SSD with SAS RAID Card
Total:
24 x 2.5" hot-swappable HDD/SSD bays
SAS card is required for SAS devices support
RAID
Depends on RAID card (in option)
Peripheral Drives
N/A
Expansion Slots
Per node:
2 x Half-length low-profile slots with PCIe x16 (Gen3 x16 bus) from CPU_0
1 x OCP mezzanine slot with PCIe Gen3 x16 bus from CPU_0
2 x M.2 slots from CPU_0 and CPU_1:
- M-key
- PCIe Gen3 x4
- Supports NGFF-2242/2260/2280/22110 cards
Total:
8 x Half-length low-profile slots with PCIe x16 (Gen3 x16 bus) from CPU_0
4 x OCP mezzanine slots with PCIe Gen3 x16 bus from CPU_0
8 x M.2 slots from CPU_0 and CPU_1:
- M-key
- PCIe Gen3 x4
- Supports NGFF-2242/2260/2280/22110 cards
2 x Half-length low-profile slots with PCIe x16 (Gen3 x16 bus) from CPU_0
1 x OCP mezzanine slot with PCIe Gen3 x16 bus from CPU_0
2 x M.2 slots from CPU_0 and CPU_1:
- M-key
- PCIe Gen3 x4
- Supports NGFF-2242/2260/2280/22110 cards
Total:
8 x Half-length low-profile slots with PCIe x16 (Gen3 x16 bus) from CPU_0
4 x OCP mezzanine slots with PCIe Gen3 x16 bus from CPU_0
8 x M.2 slots from CPU_0 and CPU_1:
- M-key
- PCIe Gen3 x4
- Supports NGFF-2242/2260/2280/22110 cards
Internal I/O
Per node:
2 x M.2 slots
1 x COM header
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector
2 x M.2 slots
1 x COM header
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector
Front I/O
Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
Total:
4 x Power button with LED
4 x ID button with LED
4 x Status LED
*1 x CMC status LED
*Only one CMC status LED per system
1 x Power button with LED
1 x ID button with LED
1 x Status LED
Total:
4 x Power button with LED
4 x ID button with LED
4 x Status LED
*1 x CMC status LED
*Only one CMC status LED per system
Rear I/O
Per node:
2 x USB 3.0
1 x VGA
2 x RJ45
1 x RJ45 MLAN
1 x ID LED
Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x RJ45 MLAN
4 x ID LEDs
*1 x CMC global management port
*Only one CMC global management port per system
2 x USB 3.0
1 x VGA
2 x RJ45
1 x RJ45 MLAN
1 x ID LED
Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x RJ45 MLAN
4 x ID LEDs
*1 x CMC global management port
*Only one CMC global management port per system
Backplane Board
24 x ports
12Gb/s & 6Gb/s compatible
12Gb/s & 6Gb/s compatible
TPM
1 x TPM header with LPC interface
Optional TPM2.0 kit: CTM000
Optional TPM2.0 kit: CTM000
Power Supply
2 x 2200W redundant PSUs80 PLUS Platinum
AC Input:- 100-127V~/ 14A, 47-63Hz- 200-240V~/ 12.6A, 47-63HzDC Input:
- 240Vdc/ 12.6A
DC Output:- Max 1200W/ 100-127V~+ 12.12V/ 95.6A+ 12Vsb/ 3.5A- Max 2200W/ 200-240V~
+ 12.12V/ 178.1A+ 12Vsb/ 3.5A
NOTE:
* The system power supply requires C19 type power cord
* 2000W 80 PLUS Titanium PSU as an option
AC Input:- 100-127V~/ 14A, 47-63Hz- 200-240V~/ 12.6A, 47-63HzDC Input:
- 240Vdc/ 12.6A
DC Output:- Max 1200W/ 100-127V~+ 12.12V/ 95.6A+ 12Vsb/ 3.5A- Max 2200W/ 200-240V~
+ 12.12V/ 178.1A+ 12Vsb/ 3.5A
NOTE:
* The system power supply requires C19 type power cord
* 2000W 80 PLUS Titanium PSU as an option
System Management
Aspeed® AST2500 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
- Dashboard
- JAVA Based Serial Over LAN
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Windows Server 2012 R2 with Update
Windows Server 2016
Red Hat Enterprise Linux 7.4 (x64) or later
Red Hat Enterprise Linux 8.0 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later
SUSE Linux Enterprise Server 11 SP4 (x64) or later
SUSE Linux Enterprise Server 12 SP3 (x64) or later
SUSE Linux Enterprise Server 15 (x64) or later
Ubuntu 16.04 LTS (x64) or later
Ubuntu 18.04 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later
VMware ESXi 6.5 Update1 or later
VMware ESXi 6.7 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later
Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.4.0 or later
Citrix Hypervisor 8.0.0 or later
Windows Server 2016
Red Hat Enterprise Linux 7.4 (x64) or later
Red Hat Enterprise Linux 8.0 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later
SUSE Linux Enterprise Server 11 SP4 (x64) or later
SUSE Linux Enterprise Server 12 SP3 (x64) or later
SUSE Linux Enterprise Server 15 (x64) or later
Ubuntu 16.04 LTS (x64) or later
Ubuntu 18.04 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later
VMware ESXi 6.5 Update1 or later
VMware ESXi 6.7 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later
Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.4.0 or later
Citrix Hypervisor 8.0.0 or later
System Fans
8 x 80x80x38mm (16,300rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Weight
35 kg (full packaging)
Packaging Dimensions
1167 x 700 x 309 mm
Packaging Content
1 x H261-Z60
8 x CPU heatsinks
1 x Rail Kit
8 x CPU heatsinks
1 x Rail Kit
Part Numbers
- Barebone package: 6NH261Z60MR-00-1*
- Motherboard: 9MZ61HD0NR-00-1*
- Rail kit: 25HB2-NJ2102-N1R
- CPU heatsink: 25ST1-44320K-A0R/25ST1-44320L-A0R
- Back plane board: 9CBPH0O0NR-00
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power Supply: 25EP0-222001-D0S
- C19 type power cord 125V/15A (US): 25CP1-018000-Q0R (optional)
- C19 type power cord 250V/16A (EU): 25CP3-01830H-Q0R (optional)
- C19 type power cord 250V/15A (US): 25CP1-018300-Q0R (optional)
- Ring topology kit: 6NH23NR48SR-00 (optional)
- Motherboard: 9MZ61HD0NR-00-1*
- Rail kit: 25HB2-NJ2102-N1R
- CPU heatsink: 25ST1-44320K-A0R/25ST1-44320L-A0R
- Back plane board: 9CBPH0O0NR-00
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power Supply: 25EP0-222001-D0S
- C19 type power cord 125V/15A (US): 25CP1-018000-Q0R (optional)
- C19 type power cord 250V/16A (EU): 25CP3-01830H-Q0R (optional)
- C19 type power cord 250V/15A (US): 25CP1-018300-Q0R (optional)
- Ring topology kit: 6NH23NR48SR-00 (optional)
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