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Описание товара GIGABYTE H242-Z10 (rev. A00)
HCI Server - AMD EPYC™ 7003 - 2U 4-Node UP 4-Bay NVMe/SATA
- Supports 5G network infrastructure
- 2U 4-node rear access server system for Edge Computing
- AMD EPYC™ 7003 Series processors
- Single processor per node, 7nm technology
- 8-Channel RDIMM/LRDIMM DDR4, 32 x DIMMs
- 8 x 1Gb/s LAN ports (Intel® I350-AM2)
- 4 x 2.5" Gen3 NVMe/SATA hot-swappable bays
- 8 x M.2 slots with PCIe Gen3 x4 interface
- 4 x LP PCIe Gen4 x16 slots
- 4 x LP PCIe Gen3 x16 slots
- 4 x OCP 2.0 Gen3 x16 mezzanine slots
- Aspeed® AST2500 remote management controller
- Dual 1200W (240V) 80 PLUS Platinum redundant power supply
Технические характеристики
Dimensions (WxHxD, mm)
2U 4-Node - Rear access
440 x 87.5 x 475
440 x 87.5 x 475
Motherboard
MZ12-HD0 Rev. 3.0
CPU
AMD EPYC™ 7003 Series processors
Single processor per node, 7nm technology
Up to 64-core, 128 threads per processor
TDP up to 225W, cTDP up to 240W
Supports cTDP 280W at ambient 30°C
Compatible with AMD EPYC™ 7002 Series processors
Single processor per node, 7nm technology
Up to 64-core, 128 threads per processor
TDP up to 225W, cTDP up to 240W
Supports cTDP 280W at ambient 30°C
Compatible with AMD EPYC™ 7002 Series processors
Socket
Per Node:
1 x LGA 4094
Total:
4 x LGA 4094
Socket SP3
1 x LGA 4094
Total:
4 x LGA 4094
Socket SP3
Chipset
System on Chip
Memory
Per node:
8 x DIMM slots
Total:
32 x DIMM slots
DDR4 memory supported only
8-Channel memory architecture
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
Memory speed: Up to 3200 MHz
8 x DIMM slots
Total:
32 x DIMM slots
DDR4 memory supported only
8-Channel memory architecture
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
Memory speed: Up to 3200 MHz
LAN
Per node:
2 x 1GbE LAN ports (1 x Intel® I350-AM2)
NCSI function supported
1 x Dedicated management port
Total:
8 x 1GbE LAN ports (4 x Intel® I350-AM2)
NCSI function supported
4 x Dedicated management ports
2 x 1GbE LAN ports (1 x Intel® I350-AM2)
NCSI function supported
1 x Dedicated management port
Total:
8 x 1GbE LAN ports (4 x Intel® I350-AM2)
NCSI function supported
4 x Dedicated management ports
Video
Integrated in Aspeed® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Storage
Per node:
1 x 2.5" Gen3 NVMe/SATA hot-swappable bay
Total:
4 x 2.5" Gen3 NVMe/SATA hot-swappable bays
1 x 2.5" Gen3 NVMe/SATA hot-swappable bay
Total:
4 x 2.5" Gen3 NVMe/SATA hot-swappable bays
SAS
N/A
RAID
N/A
Expansion Slots
Per node:
1 x PCIe x16 (Gen4 x16) low-profile slot
1 x PCIe x16 (Gen3 x16) low-profile slot
1 x OCP 2.0 mezzanine slot with PCIe Gen3 x16 bandwidth (Type1, P1, P2, P3, P4 with NCSI supported)
2 x M.2 slots:
- M-key
- PCIe Gen3 x4
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device
Total:
4 x PCIe x16 (Gen4 x16) low-profile slots
4 x PCIe x16 (Gen3 x16) low-profile slots
4 x OCP 2.0 mezzanine slots with PCIe Gen3 x16 bandwidth (Type1, P1, P2, P3, P4 with NCSI supported)
8 x M.2 slots:
- M-key
- PCIe Gen3 x4
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device
1 x PCIe x16 (Gen4 x16) low-profile slot
1 x PCIe x16 (Gen3 x16) low-profile slot
1 x OCP 2.0 mezzanine slot with PCIe Gen3 x16 bandwidth (Type1, P1, P2, P3, P4 with NCSI supported)
2 x M.2 slots:
- M-key
- PCIe Gen3 x4
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device
Total:
4 x PCIe x16 (Gen4 x16) low-profile slots
4 x PCIe x16 (Gen3 x16) low-profile slots
4 x OCP 2.0 mezzanine slots with PCIe Gen3 x16 bandwidth (Type1, P1, P2, P3, P4 with NCSI supported)
8 x M.2 slots:
- M-key
- PCIe Gen3 x4
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device
Internal I/O
Per node:
2 x M.2 slots
1 x USB 3.0 header
1 x TPM header
1 x OCP 2.0 mezzanine slot
1 x Front panel header
1 x Backplane board header
1 x IPMB connector
1 x Clear CMOS jumper
1 x BIOS recovery jumper
2 x M.2 slots
1 x USB 3.0 header
1 x TPM header
1 x OCP 2.0 mezzanine slot
1 x Front panel header
1 x Backplane board header
1 x IPMB connector
1 x Clear CMOS jumper
1 x BIOS recovery jumper
Front I/O
Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x Reset button
Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Status LEDs
4 x Reset buttons
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x Reset button
Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Status LEDs
4 x Reset buttons
Rear I/O
Per node:
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
1 x ID LED
Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x MLAN
4 x ID LEDs
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
1 x ID LED
Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x MLAN
4 x ID LEDs
Backplane Board
Speed and bandwidth:
PCIe Gen3 x4 or SATA 6Gb/s
PCIe Gen3 x4 or SATA 6Gb/s
TPM
1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Optional TPM2.0 kit: CTM010
Power Supply
Dual 1200W 80 PLUS Platinum redundant power supplyAC Input:- 100-127V~/ 12.47A, 47-63Hz- 200-240V~/ 7.08A, 47-63Hz
DC Output:- Max 1000W/ 100-127V~+ 12V/ 82A+ 12Vsb/ 2A- Max 1200W/ 200-240V~+ 12V/ 98A+ 12Vsb/ 2A
Dual 1300W 80 PLUS Platinum redundant power supplies (-A01)AC Input:- 100-240V~/ 12-7A, 50-60Hz- 200-240V~/ 8A, 50-60Hz
DC Input:- 240Vdc/ 6.5ADC Output:- Max 1000W/ 100-240V~+ 12V/ 80.5A+ 12Vsb/ 3A- Max 1300W/ 200-240V~ or 240Vdc Input+ 12V/ 105.4A+ 12Vsb/ 3A
DC Output:- Max 1000W/ 100-127V~+ 12V/ 82A+ 12Vsb/ 2A- Max 1200W/ 200-240V~+ 12V/ 98A+ 12Vsb/ 2A
Dual 1300W 80 PLUS Platinum redundant power supplies (-A01)AC Input:- 100-240V~/ 12-7A, 50-60Hz- 200-240V~/ 8A, 50-60Hz
DC Input:- 240Vdc/ 6.5ADC Output:- Max 1000W/ 100-240V~+ 12V/ 80.5A+ 12Vsb/ 3A- Max 1300W/ 200-240V~ or 240Vdc Input+ 12V/ 105.4A+ 12Vsb/ 3A
System Management
Aspeed® AST2500 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
- Dashboard
- JAVA Based Serial Over LAN
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Windows Server 2016 (X2APIC/256T not supported)
Windows Server 2019
Windows Server 2022
Red Hat Enterprise Linux 8.3 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later
SUSE Linux Enterprise Server 12 SP5 (x64) or later
SUSE Linux Enterprise Server 15 SP2 (x64) or later
Ubuntu 18.04.5 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later
VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update1 or later
VMware ESXi 8.0 or later
Citrix Hypervisor 8.2.0 or later
Windows Server 2019
Windows Server 2022
Red Hat Enterprise Linux 8.3 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later
SUSE Linux Enterprise Server 12 SP5 (x64) or later
SUSE Linux Enterprise Server 15 SP2 (x64) or later
Ubuntu 18.04.5 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later
VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update1 or later
VMware ESXi 8.0 or later
Citrix Hypervisor 8.2.0 or later
System Fans
3 x 80x80x38mm (16,300rpm)
1 x 40x40x28mm (25,000rpm)
1 x 40x40x28mm (25,000rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Weight
Net Weight: 19.8 kg
Gross Weight: 29.44 kg
Gross Weight: 29.44 kg
Packaging Dimensions
857 x 670 x 280 mm
Packaging Content
1 x H242-Z10
4 x CPU heatsinks
1 x 2-Section Rail Kit
4 x CPU heatsinks
1 x 2-Section Rail Kit
Part Numbers
- Barebone package: 6NH242Z10MR-00-A*
- Motherboard: 9MZ12HD0NR-00
- 2-Section Rail kit: 25HB2-AA6107-K0R
- Backplane board - CBPH043: 9CBPH043NR-00
- CPU heatsink: 25ST1-44320J-A0R
- Fan module: 25ST2-44282D-D0R/25ST2-88382E-D0R
- 1200W power supply: 25EP0-212008-D0S
- 1300W power supply (-A01): 25EP0-213006-F3S
Optional parts:
- M.2 expansion card - CMTP051: 9CMTP051NR-00
- CMC Kit: 6NH242Z12SR-00
- M.2 heatsink kit: 6NH242Z17SR-00-100
- RMA packaging: 6NH242Z10SR-RMA-A100
- Motherboard: 9MZ12HD0NR-00
- 2-Section Rail kit: 25HB2-AA6107-K0R
- Backplane board - CBPH043: 9CBPH043NR-00
- CPU heatsink: 25ST1-44320J-A0R
- Fan module: 25ST2-44282D-D0R/25ST2-88382E-D0R
- 1200W power supply: 25EP0-212008-D0S
- 1300W power supply (-A01): 25EP0-213006-F3S
Optional parts:
- M.2 expansion card - CMTP051: 9CMTP051NR-00
- CMC Kit: 6NH242Z12SR-00
- M.2 heatsink kit: 6NH242Z17SR-00-100
- RMA packaging: 6NH242Z10SR-RMA-A100
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